Focus on trends in chip miniaturization and high-density packaging (e.g., SiP, CoWoS); relate to the needs of the semiconductor manufacturing industry in Thai-speaking regions (e.g., supporting the chip industry chain in Thailand's Eastern Economic Corridor).
Industry Pain Points
Difficult heat dissipation for high-power chips, low yield rate in miniaturized packaging, high signal transmission loss, and high manufacturing costs.
Application Scenarios
HPC Chip
Automotive Power Module
Consumer CSP
Memory Chip
Solutions
Thermal Management
Uses advanced substrates, underfill materials, and cooling solutions to improve reliability and power efficiency.
Heterogeneous Integration
Combines multiple dies (logic, memory, sensors) in a single package for optimized system-level performance.
Manufacturing & Scalability
Adopts panel-level packaging and AI-driven process control to enhance yield and reduce costs.
Thermal Management
Uses advanced substrates, underfill materials, and cooling solutions to improve reliability and power efficiency.
Heterogeneous Integration
Combines multiple dies (logic, memory, sensors) in a single package for optimized system-level performance.
Manufacturing & Scalability
Adopts panel-level packaging and AI-driven process control to enhance yield and reduce costs.
